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US 2022/0013475 A1Published application
Semiconductor packages
AssigneeSamsung Electronics Co., Ltd.
InventorsChulwoo Kim, Yanggyoo Jung, Soohyun Nam
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a substrate including a wiring, a semiconductor chip structure on the substrate, and electrically connected to the wiring, an underfill resin in a space between the substrate and the semiconductor chip structure, and a stiffener surrounding the semiconductor chip structure, on the substrate, wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.
Claims20
A semiconductor package comprising:
- a substrate including a wiring;
- a semiconductor chip structure on the substrate, and electrically connected to the wiring;
- an underfill resin in a space between the substrate and the semiconductor chip structure;
- and
- a stiffener surrounding a side surface of the semiconductor chip structure, on the substrate,
- wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity.
3 more elements
A semiconductor package comprising:
- a substrate including a first wiring;
- an interposer substrate on the substrate, and including a second wiring electrically connected to the first wiring;
- a semiconductor chip structure on the interposer substrate, and including first and second semiconductor chip structures electrically connected to each other by the second wiring;
- and
- a stiffener surrounding a side surface of the interposer substrate and a side surface of the semiconductor chip structure, on the substrate,
- wherein the stiffener includes a conductive frame having a cavity and an insulating filler in the cavity,
- wherein the conductive frame comprises a metal material, and
- wherein the insulating filler comprises an organic material.
5 more elements
A semiconductor package comprising:
- a substrate;
- a semiconductor chip structure on the substrate;
- a conductive frame surrounding the semiconductor chip structure on the substrate;
- and
- an insulating filler in an inside of the conductive frame,
- wherein the insulating filler comprises a material having a glass transition temperature (Tg).
3 more elements
Dependencies are inferred from the claim text.