Semiconductor package

A semiconductor package, comprising:

• a semiconductor chip including a normal connection electrode and a measurement connection electrode that are formed on a first surface;
• and
• a substrate including a normal substrate pad that is connected to the normal connection electrode and a measurement substrate pad that is connected to the measurement connection electrode, the normal substrate pad and the measurement substrate pad being formed on a surface that faces the first surface,
• wherein the measurement connection electrode includes first and second edge measurement connection electrodes that are formed at both side edge regions of the semiconductor chip, respectively, the side edge regions running along a first direction, and first and second center measurement connection electrodes that are arranged in a center region of the semiconductor chip to be spaced apart from each other, the center region disposed between the both side edge regions in the first direction,
• wherein the measurement substrate pad includes a center measurement substrate pad with a long side in an arrangement direction of the first and second center measurement connection electrodes to simultaneously connect the first and second center measurement connection electrodes, a first edge measurement substrate pad with a long side crossing the center measurement substrate pad while being connected to the first edge measurement connection electrode, and a second edge measurement substrate pad with a long side crossing the center measurement substrate pad while being connected to the second edge measurement connection electrode, and
• wherein the first edge measurement connection electrode and the first center measurement connection electrode are electrically connected to each other, and the second edge measurement connection electrode and the second center measurement connection electrode are electrically connected to each other.