Method for manufacturing wiring substrate

A method for manufacturing a wiring substrate, comprising:

• forming a plurality of conductor pads on an insulating layer such that the plurality of conductor pads includes a plurality of first conductor pads and a plurality of second conductor pads;
• forming a plurality of protruding parts on surfaces of the first conductor pads of the plurality of conductor pads, respectively;
• forming a resin layer such that the resin layer covers the insulating layer and the plurality of conductor pads;
• exposing, from the resin layer, end portions of the protruding parts on an opposite side with respect to the insulating layer;
• forming, in the resin layer, a plurality of openings such that the openings expose surfaces of the second conductor pads of the plurality of conductor pads, respectively;
• and
• forming a coating film on the surfaces of the second conductor pads exposed in the openings.