Methods and systems for expediting multi-perspective wafer analysis

A computerized system for obtaining and analyzing multi-perspective scan data of a wafer, the system comprising:

• scanning equipment switchable between perspectives from a multiplicity of perspectives;
• and
• a scan data analysis module configured to receive scan data obtained by the scanning equipment;
• wherein the scanning equipment is configured to scan a plurality of pages on a wafer, one page after the other, at least some of the pages comprising multiple adjacent slices, such that each page is successively scanned in each of the multiplicity of perspectives, before switching to a next page, until the scan of the wafer has been completed;
• and
• wherein the scan data analysis module is configured to analyze the scan data from each page, and identify defects therein, based on an integrated analysis of the scan data from each of the multiplicity of perspectives.

A non-transitory computer-readable medium storing instructions that cause a wafer analysis system to:

• scan a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives;
• and
• analyze scan data of a last scanned page while scanning a next page from the plurality of pages;
• wherein at least some of the pages comprise multiple slices of the wafer;
• and
• wherein the analysis of the scan data comprises identifying defects in the scanned pages, based on an integrated analysis taking into account scan data from each of the multiplicity of perspectives.