US 2022/0011728 A1 · METHOD TO PREDICT YIELD OF A DEVICE MANUFACTURING PROCESS

Abstract

A method for predicting yield relating to a process of manufacturing semiconductor devices on a substrate, the method including: obtaining a trained first model which translates modeled parameters into a yield parameter, the modeled parameters including: a) a geometrical parameter associated with one or more selected from: a geometric characteristic, dimension or position of a device element manufactured by the process and b) a trained free parameter; obtaining process parameter data including data regarding a process parameter characterizing the process; converting the process parameter data into values of the geometrical parameter; and predicting the yield parameter using the trained first model and the values of the geometrical parameter.

Claims21

Dependent claims

A method comprising:

obtaining a trained first model which translates modeled parameters into a yield parameter relating to a process of manufacturing semiconductor devices on a substrate, the modeled parameters comprising:
a) one or more geometrical parameters associated with one or more selected from:
a geometric characteristic, dimension or position of a device element manufactured by the process and b) one or more trained free parameters;
obtaining process parameter data comprising data of one or more process parameters characterizing the semiconductor manufacturing process;
converting the process parameter data into values of the one or more geometrical parameters;
and
predicting the yield parameter using the trained first model and the values of the one or more geometrical parameters.

4 more elements

A computer program product comprising a non-transitory computer-readable medium having instructions therein, the instructions, upon execution by a computing system, configured to cause the computing system to at least:

obtain a trained first model which translates modeled parameters into a yield parameter relating to a process of manufacturing semiconductor devices on a substrate, the modeled parameters comprising:
a) one or more geometrical parameters associated with one or more selected from:
a geometric characteristic, dimension or position of a device element manufactured by a semiconductor manufacturing process and b) one or more trained free parameters;
obtain process parameter data comprising data of one or more process parameters characterizing the semiconductor manufacturing process;
convert the process parameter data into values of the one or more geometrical parameters;
and
predict the yield parameter using the trained first model and the values of the one or more geometrical parameters.

4 more elements

Dependencies are inferred from the claim text.

Method to predict yield of a device manufacturing process

Life of this patent

Method to predict yield of a device manufacturing process

Life of this patent

Abstract

Claims21