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US 2022/0010425 A1Published application
Solid precursor feed system for thin film depositions
AssigneeMetOx Technologies, Inc.
InventorsMikhail NOVOZHILOV, Alex IGNATIEV
Life of this patent
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Abstract
A dry powder MOCVD vapor source system is disclosed that utilizes a gravimetric powder feeder, a feed rate measurement and feeder control system, an evaporator and a load lock system for continuous operation for thin film production, particularly of REBCO type high temperature superconductor (HTS) tapes.
Claims20
A load lock assembly for recharging powder to a powder feed system operated under vacuum, the assembly comprising:
- a powder containing load lock chamber located separate from a powder vessel of a powder feed system;
- a plurality of gas control valves in communication with the load lock chamber;
- a flow control orifice disposed in line with a gas control valve,
- a gate valve located in between the load lock chamber and the powder vessel and configured for transferring powder from the load lock chamber to the powder vessel;
- and
- wherein the load lock chamber is pressure isolated from the powder vessel and the plurality of gas control valves are configured to provide for addition of powder to the powder vessel while maintaining vacuum in the powder vessel.
3 more elements
A precursor powder feed system for deposition of thin films, the system comprising:
- a powder vessel maintained under vacuum for housing a precursor powder;
- a load lock assembly located outside the powder vessel and comprising a pressure isolated chamber for reloading the powder vessel, wherein a plurality of gas control valves and a gate valve pressure isolate the load lock assembly from the powder vessel to provide for addition of powder precursor while the feed system operates continuously, and a flow control orifice to equalize pressure between the load lock assembly and powder vessel;
- a scale coupled to the powder vessel and configured to provide continuous mass data of precursor powder in the powder vessel;
- a mechanically driven powder feeder coupled to the powder vessel and configured to receive powder from the powder vessel;
- and
- an evaporator configured to receive the powder from the powder feeder and evaporate the powder.
3 more elements
A method for manufacturing a high temperature superconductor, the method comprising:
- providing a vapor deposition reactor comprising a reactor deposition chamber operating under vacuum conditions and configured for depositing a high-temperature superconductor thin film;
- loading an initial charge of precursor powder to a powder vessel maintained under vacuum and coupled to a scale and a mechanically driven powder feeder, wherein the scale is configured to provide continuous mass data of precursor powder in the powder vessel;
- coupling a load lock assembly to the powder vessel, wherein the load lock assembly is located outside the powder vessel and comprises a pressure isolated chamber for reloading the powder vessel, wherein a plurality of gas control valves and a gate valve pressure isolate the load lock assembly from the powder vessel, and a flow control orifice to equalize pressure between the load lock assembly and powder vessel;
- coupling an evaporator in between the powder feeder and the reactor deposition chamber;
- introducing a substrate to the reactor deposition chamber;
- monitoring the precursor powder vessel weight in the powder vessel;
- controlling the powder feeder based upon the powder vessel weight in order to provide a target precursor powder feed rate to the evaporator;
- evaporating the precursor powder and transporting the evaporated precursor into the reactor for deposition as a thin film upon the substrate;
- and
- recharging the powder vessel with powder precursor via the load lock assembly while the reactor operates continuously under vacuum.
7 more elements
Dependencies are inferred from the claim text.