Hot swap condensor for immersion cooling
AssigneeLiquidstack Holding B.V.
InventorKar-Wing Lau
Life of this patent
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Abstract
A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.
Claims4
1-27. (canceled)
A condensing device for use in hot swapping at least one electronic device from an immersion cooling tank having a first opening, the condensing device comprising a condensing coil forming a second opening through which the at least one electronic device is removable.
Dependencies are inferred from the claim text.