Electronic device and manufacturing method therefor
AssigneeMurata Manufacturing Co., Ltd.
InventorsShigeo Ojima, Isao Ikeda, Koki Sai
Life of this patent
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Abstract
An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.
Claims15
An electronic device comprising:
- a base substrate having a mounting surface;
- an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate;
- an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside;
- and
- a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.
A manufacturing method for an electronic device, the manufacturing method comprising:
- preparing an aggregate substrate;
- forming a first sacrificial layer on the aggregate substrate;
- mounting an electronic component on the aggregate substrate such that the first sacrificial layer supports a part of the electronic component having a mechanical vibration portion;
- covering the electronic component with a second sacrificial layer;
- covering the second sacrificial layer with an intermediate layer having at least one through-hole that extends through the intermediate layer to the second sacrificial layer;
- forming an internal space between the aggregate substrate and the intermediate layer by removing the first sacrificial layer and the second sacrificial layer through the at least one through-hole;
- and
- sealing the internal space by closing the at least one through-hole with a sealing layer.
Dependencies are inferred from the claim text.