Technologies for reconfigurable heat sinks

A method comprising:

• moving a first plurality of fins of a heat sink from a first position to a second position relative to a base of the heat sink,
• wherein the base is thermally coupled to an integrated circuit component, wherein the integrated circuit component is mated with a mainboard,
• wherein the heat sink comprises a second plurality of fins,
• wherein individual fins of the first plurality of fins are thermally coupled to the base,
• wherein individual fins of the second plurality of fins are thermally coupled to the base,
• wherein the second plurality of fins are fixed in position relative to the base,
• removing one or more memory modules from the one or more memory module slots of the mainboard while the plurality of fins are in the second position;
• adding one or more new memory modules to the one or more memory module slots while the first plurality of fins are in the second position;
• and
• moving the first plurality of fins of the heat sink from the second position to the first position after adding the one or more new memory modules,
• wherein the first plurality of fins prevents removal of the one or more memory modules from the one or more memory module slots in the first position,
• wherein the first plurality of fins does not prevent removal of the one or more memory modules from the one or more memory module slots in the second position.

A heat sink comprising:

• a first means for cooling an integrated circuit component, the first means thermally coupled to the integrated circuit component mated with the integrated circuit component;
• and
• a second means for cooling the integrated circuit component, the second means thermally and mechanically coupled to the first means,
• wherein the second means is movable relative to the first means.