Flexible circuit board, manufacturing method therefor, and package having flexible circuit board

Abstract

Provided are a flexible circuit board for forming a protective layer on an inner lead region, a manufacturing method therefor, and a package having the flexible printed circuit board. The flexible circuit board comprises: a base layer; a wiring layer which includes a plurality of electrode lines each having an inner lead and an outer lead respectively provided on both sides thereof and which is formed on at least one surface of the base layer; a first protective layer formed on the wiring layer so as to expose the inner lead and the outer lead of the electrode line; and a second protective layer formed in an inner lead region that is formed by being encompassed by the first protective layer.

Dependencies are inferred from the claim text.