Printed circuit board and manufacturing method thereof

A printed circuit board comprising:

• a first insulating layer;
• a first circuit pattern, disposed on one surface of the first insulating layer, enclosed in the first insulating layer in such a way that one surface of the first circuit pattern is exposed through the one surface of the first insulating layer and remaining surfaces of the first circuit pattern excluding the one surface of the first circuit pattern are covered by the first insulating layer;
• a second circuit pattern, disposed on second surface of the first insulating layer, spaced apart from the first circuit pattern and protruded from the second surface of the first insulating layer toward an opposite side of the first circuit pattern;
• an adhesive layer disposed on the second surface of the first insulating layer to contact a portion of the first insulating layer and a side surface of the second circuit pattern;
• an electronic component disposed on the adhesive layer and adjacent to the second circuit pattern;
• and
• a second insulating layer disposed on the second surface of the first insulating layer and covering at least a portion of each of the electronic component and the second circuit pattern.