In-mold electronic component and method for manufacturing the same

A method for manufacturing an in-mold electronic component, comprising:

• printing a decorative layer on a side of a first film layer;
• forming a hole in a second film layer, and filling the hole with a conductive material;
• printing a circuit layer and a conductive layer on a side of the second film layer, and patterning the conductive layer to form a touch unit electrically connected to the circuit layer, the circuit layer being electrically connected to the conductive material;
• electrically connecting a display unit to the circuit layer;
• forming a plastic layer between the first film layer and the second film layer through an injection molding process, the plastic layer being configured to seal the decorative layer, the circuit layer, the display unit, and the touch unit;
• and
• binding an end of the conductive material away from the circuit layer to a flexible printed circuit.

A method for manufacturing an in-mold electronic component, comprising:

• printing a decorative layer on a side of a first film layer;
• printing a circuit layer and a conductive layer on the decorative layer, and patterning the conductive layer to form a touch unit electrically connected to the circuit layer;
• electrically connecting a display unit to the circuit layer, and fixing a connecting pin of a pin header to the circuit layer;
• and
• forming a plastic layer on a side of the circuit layer away from the first film layer through an injection molding process, and enabling a pin head of the pin header to protrude from the plastic layer.