Transmission circuit board and method for manufacturing the same

A method for manufacturing the transmission circuit board, comprising:

• providing an inner circuit substrate board;
• wherein the inner circuit substrate board comprises a bendable area, a first transmission area, and a second transmission area;
• the first transmission area and the second transmission area are connected to the bendable area;
• the inner circuit substrate board further comprises a substrate layer and an inner circuit layer formed on the substrate layer;
• the inner circuit layer comprises at least one first signal circuit;
• pressing a first outer circuit substrate board on the inner circuit layer;
• wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer;
• the first dielectric layer is located in the first transmission area and the second transmission area;
• two ends of the first signal circuit are electrically connected to the first outer circuit layer;
• forming a first protecting layer on the first outer circuit layer;
• and
• forming a first shielding layer on the first protecting layer, electrically connecting first shielding layer to the first outer circuit layer, and locating the first shielding layer in the bendable area.