Intrinsic-stress self-compensated microelectromechanical systems transducer

A transducer for a microphone including a housing having an interior, an exterior, and a port permitting fluid communication between the interior of the housing and the exterior of the housing, the transducer comprising:

• a diaphragm configured to deflect in a generally vertical direction in response to changes in a differential pressure, the diaphragm comprising a lattice grid configured to reduce deflection in a generally lateral direction due to intrinsic tensile stress, the diaphragm comprising:
• a first clamped-clamped beam, the ends of the first clamped-clamped beam secured to the housing proximate the port;
• a second clamped-clamped beam, the ends of the second clamped-clamped beam secured to the housing proximate the port;
• and
• the lattice grid extending between the first clamped-clamped beam and the second clamped-clamped beam, the lattice grid including a plurality of openings therein, the plurality of openings comprising:
• a first plurality of openings extending substantially parallel to the first clamped-clamped beam and the second clamped-clamped beam;
• and
• a second plurality of openings extending substantially parallel to the first clamped-clamped beam and the second clamped-clamped beam, the second plurality of openings substantially offset from the first plurality of openings in a direction substantially parallel to the first clamped-clamped beam and the second clamped-clamped beam;
• and
• a dielectric actuator comprising:
• an electrode secured in a fixed position;
• and
• a dielectric bar coupled to the diaphragm and configured to move in a substantially vertical direction in response to deflection of the diaphragm, the dielectric bar positioned relative to the electrode such that deflection of the diaphragm changes a capacitance of the electrode.

A microphone comprising:

• a housing having an interior, an exterior, and a port permitting fluid communication between the interior of the housing and the exterior of the housing;
• a MEMS transducer positioned within the interior of the housing, at least a portion of the MEMS transducer in fluid communication with the exterior of the housing through the port, the MEMS transducer comprising:
• a diaphragm configured to deflect in response to changes in a differential pressure between a pressure within the closed chamber and a pressure of the outside environment of the microphone, the diaphragm comprising:
• a first clamped-clamped beam, the ends of the first clamped-clamped beam secured to the MEMS substrate;
• a second clamped-clamped beam, the ends of the second clamped-clamped beam secured to the MEMS substrate;
• and
• a lattice grid suspended between the first clamped-clamped beam and the second clamped-clamped beam, the lattice grid including a plurality of openings therein, the plurality of openings comprising:
• a first plurality of openings extending substantially parallel to the first clamped-clamped beam and the second clamped-clamped beam;
• and
• a second plurality of openings extending substantially parallel to the first clamped-clamped beam and the second clamped-clamped beam, the second plurality of openings offset from the first plurality of openings in a direction substantially parallel to the first clamped-clamped beam and the second clamped-clamped beam.