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US 2021/0344819 A1Published application
Heatsinks for an image capture device
AssigneeGoPro, Inc.
InventorsNicholas Vitale, Raul Vargas Gonzalez, Herman Wong
Life of this patent
Estimating the term…
Abstract
An image capture device that includes a housing and a heatsink located partially or completely within the housing. The heatsink comprises a planar surface, a printed circuit board in communication with the heatsink, and a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board.
Claims20
An image capture device comprising:
- a housing;
- a heatsink located partially or completely within the housing, wherein the heatsink comprises a planar surface;
- a printed circuit board in communication with the heatsink;
- and
- a sheet conductor that is a graphite sheet connected to the planar surface of the heatsink and in direct contact with the printed circuit board or components of the printed circuit board.
2 more elements
An image capture device comprising:
- a heatsink comprising:
- a planar surface and a cut out that are adjacent;
- a sheet conductor covering a portion of the planar surface of the heatsink, wherein the sheet conductor has a thickness that is less than the thickness of the heatsink and the sheet conductor is made of a material that has a higher thermal conductivity than the material of the heatsink.
An image capture device comprising:
- a housing;
- a heatsink located partially or completely within the housing, wherein the heatsink comprises a planar surface;
- a printed circuit board in communication with the heatsink;
- a sheet conductor located between and in direct contact with the planar surface of the heatsink and the printed circuit board;
- and
- a connector connecting the sheet conductor to the heatsink.
3 more elements
Dependencies are inferred from the claim text.