Substrate processing apparatus, stage, and temperature control method
AssigneeTokyo Electron Limited
InventorHideto SAITO
Life of this patent
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Abstract
A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.
Claims20
A substrate processing apparatus comprising:
- a stage on which a substrate is placed,
- wherein the stage includes:
- a first plate;
- a first temperature adjustment mechanism configured to control a temperature of the first plate;
- a second plate provided below the first plate;
- a second temperature adjustment mechanism configured to control a temperature of the second plate;
- and
- a fastening member configured to fasten the first plate and the second plate.
A stage comprising:
- a first plate;
- a first temperature adjustment mechanism configured to control a temperature of the first plate;
- a second plate provided below the first plate;
- a second temperature adjustment mechanism configured to control a temperature of the second plate;
- and
- a fastening member configured to fasten the first plate and the second plate.
A method of controlling a temperature of a stage including a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate, the method comprising:
- (a) measuring a shape of a substrate placed on the stage;
- and
- (b) controlling the first temperature adjustment mechanism or the second temperature adjustment mechanism based on the measured shape of the substrate.
Dependencies are inferred from the claim text.