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US 2021/0344100 A1Published application
Waveguide antenna with integrated temperature management
AssigneeAptiv Technologies AG
InventorsScott D. Brandenburg, David W. Zimmerman, Shawn Shi
Life of this patent
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Abstract
An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
Claims15
An antenna, comprising:
- at least one antenna element;
- an integrated circuit operatively associated with the at least one antenna element;
- and
- a waveguide situated near the at least one antenna element, the waveguide including at least one passage through which radiation may pass toward or away from the at least one antenna element, the waveguide having a heat dissipation portion at least partially within the waveguide, the heat dissipation portion being in a thermally conductive relationship with the integrated circuit and configured to reduce a temperature of the integrated circuit.
1 more element
Dependencies are inferred from the claim text.