US 2021/0343977 A1 · ENCAPSULATION FILM

Abstract

The present disclosure relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, and provides an encapsulation film which can form a structure capable of blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby effectively releasing the heat accumulated in the organic electronic device and preventing the occurrence of deterioration of the organic electronic device.

Claims20

Dependent claims

An organic electronic element encapsulation film, comprising:

an encapsulation layer encapsulating an organic electronic element, and a metal layer having two or more layers formed on the encapsulation layer,
wherein a horizontal direction thermal resistance of the encapsulation film measured according to ISO 22007-2 is 800K/W or less.

Dependencies are inferred from the claim text.

Facts

Application

17/270,823Filed 3 Sep 2019

Priority

KR 10-2018-01045503 Sep 2018

Published

4 Nov 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10K 50/87
Constructional details: arrangements for heating or cooling
H10K 50/844
Passivation; Containers; Encapsulations: encapsulations
H10K 50/846
Passivation; Containers; Encapsulations: comprising getter material or desiccants
H10K 50/8445
Encapsulations: multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Encapsulation film

Life of this patent

Encapsulation film

Life of this patent

Abstract

Claims20