Microelectronic workpiece processing systems and associated methods of color correction
AssigneeMicron Technology, Inc.
InventorsKevin Tetz, Charles M. Watkins
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Abstract
Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
Claims20
A system for processing a semiconductor substrate, comprising:
- a substrate support configured to carry a microelectronic workpiece comprising a plurality of light emitting diodes (LEDs);
- a plurality of containers, each of the plurality of containers holding a different converter material;
- a mixer operatively coupled to the plurality of containers, the mixer configured to regulate at least one of a concentration and a flow rate of the converter materials out of the plurality of containers;
- an injector positioned to introduce one or more of the converter materials from the mixer onto the plurality of LEDs of the microelectronic workpiece;
- and
- a controller operatively coupled to the mixer and the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising:
- measuring a base emission characteristic of each of the plurality of LEDs on the microelectronic workpiece;
- developing an emission map of the plurality of LEDs based at least partially on the measured base emission characteristics;
- and
- causing the injector to introduce the one or more of the converter materials onto each of the plurality LEDs based on the emission map and a compensation scheme.
A system for processing a semiconductor substrate, comprising:
- a substrate support configured to carry a microelectronic workpiece comprising a plurality of light emitting diodes (LEDs);
- a probe operably couplable to the microelectronic workpiece and configured to test the plurality of LEDs on the microelectronic workpiece;
- and
- a controller operatively coupled to the probe, the controller configured to:
- measure, through the probe, a base emission characteristic of each of the plurality of LEDs on the microelectronic workpiece;
- develop an emission map of the plurality of LEDs based at least partially on the measured base emission characteristics;
- and
- develop a compensation scheme based at least partially on the emission map, wherein the compensation scheme includes a selection of a group of candidate converter materials, each converter material configured to adjust the measured base emission characteristics of the plurality of LEDs on the workpiece.
A system for processing a semiconductor substrate, comprising:
- a substrate support configured to individually carry a microelectronic workpiece comprising a plurality of light emitting diodes (LEDs);
- a dispensing component holding a plurality of converter materials, the dispensing component configured to regulate at least one of a concentration and a flow rate of the converter materials out of the dispensing component;
- a measuring component operably couplable to the microelectronic workpiece and configured to measure base emission characteristics of each of the plurality of LEDs;
- and
- a controller operatively coupled to the dispensing component and the measuring component, the controller configured to:
- determine, through the measuring component, one or more base emission characteristics for each of the plurality of LEDs on the microelectronic workpiece;
- develop an emission map of the plurality of LEDs based at least partially on the measured base emission characteristics;
- develop a compensation scheme based at least partially on the emission map;
- and
- cause the dispensing component to dispense one or more of the converter materials onto each of the plurality LEDs based on the emission map and the compensation scheme.
Dependencies are inferred from the claim text.