Semiconductor packaging method and semiconductor package device

Abstract

A semiconductor packaging method and a semiconductor package device are provided. The packaging method includes providing a chip. The chip includes a chip substrate having a front surface and a back surface, where the front surface includes a photosensitive region; a plurality of pads disposed at the front surface of the chip substrate and around the photosensitive region, where the chip substrate contains a through-hole formed from the back surface of the chip substrate, and the plurality of pads are exposed from the through-hole; and a transparent protection layer over the front surface of the chip substrate, where the transparent protection layer covers the photosensitive region and the plurality of pads. The packaging method also includes electrically connecting each pad of the plurality of pads to a circuit board through a corresponding metal rewiring layer in the through-hole.

Dependencies are inferred from the claim text.