Anti-flare semiconductor packages and related methods
AssigneeSemiconductor Components Industries, LLC
InventorShou-Chian HSU
Life of this patent
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Abstract
Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side. A first side of an optically transmissive lid may be coupled to the second side of the semiconductor die through one or more dams. The packages may also include a light block material around the semiconductor package extending from the first side of the semiconductor die to a second side of the optically transmissive lid. The package may include an opening in the light block material on the second side of the optically transmissive lid that substantially corresponds with an active area of the semiconductor die.
Claims20
A semiconductor package comprising:
- a semiconductor die comprising a first side and a second side;
- a first side of an optically transmissive lid coupled to the second side of the semiconductor die through one or more dams;
- a light block material comprised around the semiconductor package extending from the first side of the semiconductor die to a second side of the optically transmissive lid;
- and
- an opening in the light block material on the second side of the optically transmissive lid that substantially corresponds with an active area of the semiconductor die;
- wherein six outer surfaces of the semiconductor package comprise the light block material.
A semiconductor package comprising:
- a semiconductor die comprising a first side and a second side;
- a first side of an optically transmissive lid coupled to the second side of the semiconductor die through one or more dams;
- and
- a light block material encapsulating the semiconductor package;
- wherein the light block material is directly coupled to a second side of the optically transmissive lid opposite the first side of the optically transmissive lid;
- and
- wherein the light block material is directly coupled to the semiconductor die.
A semiconductor package comprising:
- a semiconductor die comprising a first side and a second side;
- a first side of an optically transmissive lid coupled to the second side of the semiconductor die through one or more dams;
- a light block material comprised around the semiconductor package;
- and
- an opening in the light block material on the second side of the optically transmissive lid that substantially corresponds with an active area of the semiconductor die;
- wherein the one or more dams are directly coupled to the first side of the optically transmissive lid and the second side of the semiconductor die;
- wherein the light block material is directly coupled to the second side of the optically transmissive lid, the second side of the optically transmissive lid opposite the first side of the optically transmissive lid.
Dependencies are inferred from the claim text.