Solid-state imaging element, solid-state imaging element package, and electronic equipment

A solid-state imaging element package, comprising:

• a solid-state imaging element;
• a transparent substrate adapted to protect the solid-state imaging element;
• and
• a rib structure formed on a substrate of the solid-state imaging element to support the transparent substrate,
• the solid-state imaging element including
• an effective pixel region having a pixel-to-pixel light-shielding film formed at boundary portions between the pixels, and
• a peripheral circuit region provided around the effective pixel region, wherein,
• in a region on the substrate where the rib structure is formed within the peripheral circuit region, no light-shielding film is formed in a same layer as the pixel-to-pixel light-shielding film.

Electronic equipment comprising:

• a solid-state imaging element including
• an effective pixel region having a plurality of pixels arranged two-dimensionally in a matrix pattern, and
• a peripheral circuit region provided around the effective pixel region,
• the effective pixel region having a pixel-to-pixel light-shielding film formed at boundary portions between the pixels,
• in a region on a substrate where a rib structure is formed within the peripheral circuit region, no light-shielding film being formed in a same layer as the pixel-to-pixel light-shielding film.