Capacitor and forming method thereof, and dram and forming method thereof
AssigneeChangxin Memory Technologies, Inc.
InventorsWenfeng WANG, Shuangshuang WU
Life of this patent
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AssigneeChangxin Memory Technologies, Inc.
InventorsWenfeng WANG, Shuangshuang WU
Estimating the term…
A method for forming a capacitor includes: providing a substrate with an electric contact portion; forming a supporting layer and a sacrificial layer which are alternately laminated on a surface of the substrate, wherein the topmost layer is a supporting layer; forming a capacitor hole penetrating through the supporting layer and the sacrificial layer and exposing the electric contact portion; forming a bottom electrode layer covering an inner surface of the capacitor hole; forming a protective layer covering a surface of the bottom electrode layer; removing the sacrificial layer, during which the bottom electrode layer being protected by the protective layer; removing the protective layer; and sequentially forming a capacitor dielectric layer and a top electrode layer.
A method for forming a capacitor, comprising:
Dependencies are inferred from the claim text.