Semiconductor Package and Method of Manufacturing the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChin-Chuan Chang, Szu-Wei Lu, Chen-Hua Yu
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Abstract
A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.
Claims20
A method comprising:
- forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate;
- forming first connectors over the set of through-vias on a first side of the substrate;
- attaching the first side of the substrate to a carrier;
- thinning the substrate to expose the set of through-vias;
- forming second connectors over the set of through-vias on a second side of the substrate, the second side opposite the first side;
- bonding a device die to the second connectors;
- and
- singulating the substrate into multiple packages.
A method comprising:
- testing a first set of connectors of a first substrate, the first set of connectors electrically coupled to a first set of via structures;
- mounting the first set of connectors of the first substrate to a carrier;
- thinning the first substrate to expose the first set of via structures;
- electrically coupling a device die to the first set of via structures;
- and
- singulating the first substrate into multiple packages.
A structure comprising:
- a first material layer, the first material layer comprising a first set of through-vias, the first set of through-vias having a width which expands wider from top to bottom;
- a first set of connectors disposed over a first side of the first material layer;
- a second set of connectors disposed under a second side of the first material layer;
- a first semiconductor device coupled to the first set of connectors;
- and
- an encapsulant laterally surrounding the first semiconductor device.
Dependencies are inferred from the claim text.