Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices

(canceled)

A method of manufacturing a semiconductor device, the method comprising:

• forming a channel in a region of a substrate between a first die stack having a plurality of first dies and a second die stack having a plurality of second dies before thermally bonding the first dies together using a thermocompression bonding process, wherein the first dies are attached to each other by first film layers and the second dies are attached to each other by second film layers, and wherein the channel extends at least partially through a thickness of the substrate;
• and
• applying heat to the first die stack to cure the first film layers, wherein the channel reduces heat transfer from the first die stack to the second die stack such that a second film layer between the substrate and a lowermost second die of the second die stack remains at least substantially uncured.