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US 2021/0343684 A1Published application
Stacked decoupling capacitors with integration in a substrate
AssigneeQUALCOMM Incorporated
InventorsJonghae KIM, Milind SHAH, Periannan CHIDAMBARAM
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Abstract
Certain aspects of the present disclosure generally relate to an integrated circuit package having a land-side capacitor electrically coupled to an embedded capacitor. One example integrated circuit package generally includes a package substrate having a first capacitor embedded therein, a semiconductor die disposed above the package substrate, and a second capacitor disposed below the package substrate and electrically coupled to the first capacitor.
Claims20
An integrated circuit package, comprising:
- a package substrate having a first capacitor embedded therein;
- a semiconductor die disposed above the package substrate;
- and
- a second capacitor disposed below the package substrate and electrically coupled to the first capacitor.
1 more element
A method of fabricating an integrated circuit package, comprising:
- forming a package substrate having a first capacitor embedded therein;
- disposing a semiconductor die above the package substrate;
- and
- disposing a second capacitor below the package substrate such that the second capacitor is electrically coupled to the first capacitor.
1 more element
Dependencies are inferred from the claim text.