Component and method for producing a component

A method for producing a component, wherein the method comprises:

• providing a plurality of main bodies each having a semiconductor body and being disposed on an auxiliary carrier, wherein the plurality of main bodies are detachable from the auxiliary carrier;
• providing a carrier having a mounting surface for receiving at least one of the main bodies of the plurality of main bodies, wherein a stopping structure is arranged on the mounting surface and extends vertically beyond the mounting surface;
• transferring at least one of the main bodies of the plurality of main bodies from the auxiliary carrier to the mounting surface of the carrier using an adhering stamp;
• and
• shearing the at least one main body of the plurality of main bodies at the stopping structure for detaching the adhering stamp from the at least one main body.

A component comprising:

• a carrier;
• and
• at least one at least one main body;
• wherein:
• the at least one main body has a semiconductor body;
• the carrier has a mounting surface on which the at least one main body is arranged,
• a stopping structure is arranged on the mounting surface and projects vertically beyond the mounting surface,
• the at least one main body is directly adjacent to the stopping structure, such that the position of the at least one main body is bounded along at least one lateral direction by the stopping structure;
• and
• the stopping structure comprises a boundary element having a vertical height greater than a vertical height of the at least one main body, wherein the boundary element is directly adjacent to the at least one main body and at least partially covers the at least one main body in a top view of the mounting surface.