Semiconductor package structure and manufacturing method thereof

A manufacturing method for semiconductor package structure, comprising:

• forming a first redistribution layer on a carrier, wherein forming the first redistribution layer comprises:
• forming at least one conductive pattern and at least one dielectric layer stacked on each other on the carrier, wherein the at least one conductive pattern comprises a plurality of landing pads, and each of the plurality of landing pads and the at least one dielectric layer are separated from each other;
• forming a plurality of conductive connectors on the first redistribution layer, wherein each of the plurality of conductive connectors corresponds to and is electrically connected to one of the plurality of landing pads;
• disposing a chip on the first redistribution layer, wherein the chip is electrically connected to the first redistribution layer;
• forming an encapsulant to encapsulate the chip and the plurality of conductive connectors;
• and
• removing the carrier from the first redistribution layer.