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US 2021/0343655 A1Published application
Supports for thinned semiconductor substrates and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsMichael J. SEDDON, Francis J. CARNEY
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Abstract
Implementations of a semiconductor substrate may include a wafer including a first side and a second side; and a support structure coupled to the wafer at a desired location on the first side, the second side, or both the first side and the second side. The support structure may include an organic compound.
Claims20
A semiconductor substrate comprising:
- a wafer comprising a first side and a second side;
- and
- a support structure coupled to the wafer at a desired location on the first side, the second side, or both the first side and the second side;
- wherein the support structure comprises an organic compound.
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A semiconductor substrate comprising:
- a support structure comprising an organic compound, the support structure coupled to a thinned wafer around an edge of the thinned wafer.
A semiconductor wafer comprising:
- a planar semiconductor material comprising a substantially circular perimeter;
- and
- a support structure coupled to the planar semiconductor material adjacent to the substantially circular perimeter;
- wherein the support structure comprises an organic compound.
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Dependencies are inferred from the claim text.