Package structure applied to power converter
AssigneeSilergy Semiconductor Technology (Hangzhou) LTD
InventorsChiqing Fang, Jiaming Ye, Chen Zhao
Life of this patent
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Abstract
A package structure applied to power converters can include: a first die having a first power transistor and a first control and drive circuit; a second die having a second power transistor; a connection device configured to couple the first and second power transistors in series between a high-level pin and a low-level pin of a lead frame of the package structure; and where a common node of the first and second power transistors can be coupled to an output pin of the lead frame through a metal connection structure with a low interconnection resistance.
Claims20
A package structure applied to a power converter, the package structure comprising:
- a) a first die comprising a first power transistor and a first control and drive circuit;
- b) a second die comprising a second power transistor;
- c) a connection device configured to couple the first power transistor and the second power transistor in series between a high-level pin and a low-level pin of a lead frame that is inside the package structure;
- and
- d) wherein, a common connection point of the first power transistor and the second power transistor is coupled to an output pin of the lead frame through a metal connection structure with low interconnection resistance.
Dependencies are inferred from the claim text.