Back to results
US 2021/0343620 A1Published application
Power module package casing with protrusion supports
AssigneeSemiconductor Components Industries, LLC
InventorsYushuang YAO, Vemmond Jeng Hung NG, Chee Hiong CHEW, Qing YANG
Life of this patent
Estimating the term…
Abstract
A method includes disposing a series of protrusions on a rectangular side panel of an open four-sided box-like structure in a frame, and attaching an electronic substrate to the frame. The electronic substrate carries one or more circuit components. The series of protrusions acts as a spring-like compensator to compensate plastic deformation, twisting or warping of the frame, and to limit propagation of stress to the electronic substrate via the frame.
Claims20
A package, comprising:
- an electronic substrate attached to a frame, the electronic substrate coupled to at least one circuit component, the frame including a rectangular panel having a length and a width, the panel forming a side of an open four-sided box-like structure in the frame;
- and
- a plurality of pairs of protrusions with a dimple disposed between each pair of protrusions disposed on a top edge of the rectangular panel along the length of the panel.
A package, comprising:
- an electronic substrate attached to a frame, the electronic substrate being coupled to at least one circuit component;
- and
- a rectangular panel forming a side of an open four-sided box-like structure in the frame, the rectangular panel having at least two protrusions separated by a dimple along a length of the panel, the dimple having a dimple width smaller than a width of each of the at least two protrusions.
A method, comprising:
- disposing a plurality of pairs of protrusions with a dimple disposed between each pair of protrusions on a rectangular side panel of an open four-sided box-like structure included in a frame;
- and
- attaching an electronic substrate to the frame, the electronic substrate being coupled to at least one circuit component.
Dependencies are inferred from the claim text.