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US 2021/0343604 A1Published application
Semiconductor substrate crack mitigation systems and related methods
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. SEDDON
Life of this patent
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Abstract
Implementations of a method for healing a crack in a semiconductor substrate may include identifying a crack in a semiconductor substrate and heating an area of the semiconductor substrate including the crack until the crack is healed.
Claims18
A method for healing a crack in a semiconductor substrate, the method comprising:
- identifying a crack in a semiconductor substrate;
- heating an area of the semiconductor substrate comprising the crack until the crack is healed;
- coupling the semiconductor substrate to a carrier substrate;
- completing the processing of the semiconductor substrate while coupled to the carrier substrate;
- and
- forming a plurality of semiconductor die therefrom.
3 more elements
A method for mitigating propagation of a crack in a semiconductor substrate, the method comprising:
- identifying a crack in a semiconductor substrate;
- removing a portion of the semiconductor substrate comprising the crack;
- forming a filled area by filling an area of the semiconductor substrate from where the portion of the semiconductor substrate comprising the crack was removed;
- electronically identifying the filled area;
- and
- forming a plurality of semiconductor die from the semiconductor substrate excluding the filled area.
3 more elements
Dependencies are inferred from the claim text.