Back to results
US 2021/0343576 A1Published application
Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsYoshinori IKEDA, Toru HIRATA
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus according to the present disclosure includes a gripping mechanism and a base plate. The gripping mechanism grips a peripheral edge of a substrate. The base plate is located below the substrate gripped by the gripping mechanism and supports the gripping mechanism. Furthermore, the base plate includes a liquid drain hole that discharges a processing liquid flowing from the substrate to an upper surface of the base plate through the gripping mechanism.
Claims17
A substrate processing apparatus comprising:
- a gripping mechanism that grips a peripheral edge of a substrate;
- and
- a base plate located below the substrate gripped by the gripping mechanism and supporting the gripping mechanism, wherein
- the base plate includes a liquid drain hole that discharges a processing liquid flowing from the substrate to an upper surface of the base plate through the gripping mechanism.
1 more element
Dependencies are inferred from the claim text.