Curved semiconductor die systems and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsMichael J. SEDDON, Francis J. CARNEY
Life of this patent
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Abstract
Implementations of a curved die system may include a semiconductor die; and a die curvature support structure including an organic material coupled to a surface of the semiconductor die. The die curvature support structure may induce warpage greater than 200 microns in the surface of the semiconductor die. The die curvature support structure may be configured to induce warpage prior to coupling the semiconductor die to a correspondingly curved substrate.
Claims19
A curved die system comprising:
- a semiconductor die;
- and
- a die curvature support structure comprising an organic material coupled to a surface of the semiconductor die;
- wherein the die curvature support structure induces warpage greater than 200 microns in the surface of the semiconductor die;
- and
- wherein the die curvature support structure is configured to induce warpage prior to coupling the semiconductor die to a correspondingly curved substrate.
A method of forming a curved semiconductor die system, the method comprising:
- warping a surface of a semiconductor die against a first surface to greater than 200 microns;
- applying an organic material to at least a portion of the surface of the semiconductor die;
- and
- releasing the semiconductor die from the first surface;
- wherein after covering the surface with the organic material, the semiconductor die is warped to permit bonding with a second surface.
A method of forming a curved semiconductor die system, the method comprising:
- coupling a die curvature support structure comprising an organic compound to a surface of a semiconductor die;
- inducing warpage greater than 200 microns in the surface of the semiconductor die using the die curvature support structure prior to bonding the semiconductor die to a curved surface.
Dependencies are inferred from the claim text.