Electronic component, method of manufacturing electronic component, and electronic component package

An electronic component package comprising:

• an electronic component that includes:
• a body including a first side surface, a second side surface opposite to the first side surface, and a first principal surface;
• and
• one or more protrusions, the one or more protrusions being provided at least on at least one of the first side surface, the second side surface, or the first principal surface;
• a container that includes a recessed part containing the electronic component, the recessed part including a first inner wall face that faces the first side surface of the body of the electronic component, and a second inner wall face that faces the second side surface of the body of the electronic component;
• and
• a cover member covering the first principal surface of the body of the electronic component contained in the recessed part.

A method of manufacturing an electronic component that includes a body and one or more protrusions, the method comprising:

• preparing a base that includes a surface and is transparent to ultraviolet radiation;
• preparing a body array that includes a first principal surface and a second principal surface and includes a plurality of the bodies, the bodies being arranged side by side along the first principal surface and the second principal surface;
• putting an ultraviolet curable resin on the surface of the base, the first principal surface of the body array, or both, and attaching the first principal surface of the body array to the surface of the base with the ultraviolet curable resin interposed therebetween;
• cutting the body array attached to the base with the ultraviolet curable resin interposed therebetween and thereby separating every adjacent two of the bodies from each other;
• irradiating the first principal surface with first ultraviolet light through the base;
• and
• irradiating the second principal surface with second ultraviolet light from a side opposite to the base as viewed from the bodies to cure a first portion of the ultraviolet curable resin that adheres to the first principal surface, and thereby forming a first one of the one or more protrusions on the first principal surface.

A method of manufacturing an electronic component that includes a body and one or more protrusions, comprising:

• preparing a base including a surface;
• preparing a body array that includes a first principal surface and a second principal surface and includes a plurality of the bodies, the bodies being arranged side by side along the first principal surface and the second principal surface;
• putting a thermosetting resin on the surface of the base, the first principal surface of the body array, or both, and attaching the first principal surface of the body array to the surface of the base with the thermosetting resin interposed therebetween;
• cutting the body array attached to the base with the thermosetting resin interposed therebetween and thereby separating every adjacent two of the bodies from each other;
• forming the one or more protrusions by applying heat to at least one of:
• a portion of the thermosetting resin that adheres to a side surface of each of the bodies formed by the cutting;
• a portion of the thermosetting resin that lies at a border part between the side surface and the first principal surface;
• or a portion of the thermosetting resin that adheres to the second principal surface;
• and
• heating a portion of the thermosetting resin that lies between the surface of the base and the first principal surface.