Method of manufacturing semiconductor package

A method of manufacturing a semiconductor package, the method comprising:

• forming a package intermediate structure comprising a plurality of element areas and a dummy area around a periphery of ones of the plurality of element areas;
• forming a carrier substrate comprising a support substrate and an adhesion layer on the support substrate, wherein the adhesion layer comprises a plurality of first areas with a first adhesion strength and a second area with a second adhesion strength, and wherein the second adhesion strength is greater than the first adhesion strength;
• supporting the package intermediate structure by using the carrier substrate by adhering the package intermediate structure to the adhesion layer so that the plurality of element areas are adjacent the plurality of first areas and the dummy area is adjacent the second area;
• and
• forming a package structure by processing the package intermediate structure when the package intermediate structure is supported by the carrier substrate.

A method of manufacturing a semiconductor package, the method comprising:

• forming a photosensitive film on a support substrate;
• forming an adhesion layer comprising a first area comprising an exposed area of the photosensitive film and a second area comprising a non-exposed area of the photosensitive film by exposing a portion of the photosensitive film to UV light;
• adhering a package intermediate structure comprising an element area and a dummy area to the adhesion layer so that the element area is adjacent the first area and the dummy area is adjacent the second area;
• forming a package structure from the package intermediate structure by forming a backside structure on the package intermediate structure when the package intermediate structure is supported by the support substrate and the adhesion layer;
• removing the dummy area from the package structure by cutting the package structure and the adhesion layer when the adhesion layer is adhered to the element area and the dummy area;
• and
• removing the adhesion layer from the element area.