Electrostatic clamping system and method
AssigneeApplied Materials, Inc.
InventorJames Carroll
Life of this patent
Estimating the term…
Abstract
An electrostatic clamping system including a platen, an electrostatic electrode associated with the platen, and a sealing cover having a concave lower surface defining a cavity and having a sealing ring extending about a periphery of the lower surface, the sealing cover movable relative to the platen for being moved onto, and being moved off of, a wafer disposed on the platen, the sealing cover further having an inlet valve for introducing a gas into a space between a cover body of the sealing cover and the wafer.
Claims20
An electrostatic clamping system comprising:
- a platen;
- an electrostatic electrode associated with the platen;
- and
- a sealing cover having a concave lower surface defining a cavity and having a sealing ring extending about a periphery of the lower surface, the sealing cover movable relative to the platen for being moved onto, and being moved off of, a wafer disposed on the platen, the sealing cover further having an inlet valve for introducing a gas into a space between a cover body of the sealing cover and the wafer.
An electrostatic clamping system comprising:
- a platen;
- an electrostatic electrode embedded within the platen;
- a sealing cover having a concave lower surface defining a cavity and having a sealing ring extending about a periphery of the lower surface, the sealing cover coupled to an articulating support arm adapted to selectively move the sealing cover onto, and remove the sealing cover from, a wafer disposed on the platen, the sealing cover further having an inlet valve for introducing a gas into a space between a cover body of the sealing cover and the wafer;
- and
- a temperature management system integral with the sealing cover and comprising a temperature control element operable to vary a temperature of the sealing cover.
A method of operating an electrostatic clamping system including a platen, an electrostatic electrode associated with the platen, and a sealing cover having a concave lower surface defining a cavity and having a sealing ring extending about a periphery of the lower surface, the method comprising:
- placing a semiconductor wafer on the platen, wherein the semiconductor wafer is warped and presents a concave bottom surface to the platen;
- lowering the sealing cover onto the semiconductor wafer with the sealing ring engaging a top surface of the semiconductor wafer and forming a fluid-tight seal between a cover body of the sealing cover and the semiconductor wafer;
- and
- pumping a gas into a space between the cover body and the semiconductor wafer via an inlet valve in the cover body.
Dependencies are inferred from the claim text.