Method and apparatus to control transfer parameters during transfer of semiconductor devices
AssigneeRohinni, LLC
InventorsJustin Wendt, Cody Peterson, Andrew Huska
Life of this patent
Estimating the term…
Abstract
An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.
Claims20
An apparatus for executing a direct transfer of one or more semiconductor device die from a wafer tape to a substrate, the apparatus comprising:
- a first frame configured to hold the wafer tape;
- a second frame configured to secure the substrate such that a transfer surface is disposed facing the one or more semiconductor device die disposed on a first side of the wafer tape;
- at least one transfer wire disposed adjacent a second side of the wafer tape opposite the first side, a length of the at least one transfer wire extending in a direction toward the wafer tape;
- a vacuum unit disposed adjacent the second side of the wafer tape, the vacuum unit being configured to engage during at least a portion of the direct transfer of the one or more semiconductor device die;
- a needle actuator configured to actuate the at least one transfer wire into a die transfer position at which the at least one transfer wire presses on the second side of the wafer tape to press the one or more semiconductor device die into contact with the transfer surface of the substrate.
An apparatus comprising:
- a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate, the transfer mechanism including:
- one or more transfer wires,
- a needle actuator disposed adjacent a first side of the wafer tape and configured to move the one or more transfer wires toward and away from the transfer location, and
- a vacuum unit disposed adjacent the first side of the wafer tape, the vacuum unit being configured to engage during at least a portion of the transfer of the electrically-actuatable element.
A method for executing a direct transfer of one or more semiconductor device die from a wafer tape to a substrate, the method comprising:
- adjusting a position of at least one of a first frame configured to hold the wafer tape, a second frame configured to secure the substrate, or a needle actuator to align the wafer tape, the substrate, and the needle actuator;
- actuating, via a needle actuator disposed adjacent a first side of the wafer tape, at least one transfer wire into a die transfer position at which the at least one transfer wire presses on the wafer tape to press the one or more semiconductor device die into contact with a transfer surface of the substrate;
- and
- engaging a vacuum unit during at least a portion of the direct transfer of the one or more semiconductor device die, wherein the vacuum unit is disposed adjacent the first side of the wafer tape.
Dependencies are inferred from the claim text.