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US 2021/0343555 A1Published application
Non-planar semiconductor packaging systems and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsMichael J. SEDDON, Francis J. CARNEY
Life of this patent
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Abstract
Implementations of a packaging system may include a wafer; and a curvature adjustment structure coupled thereto where the curvature adjustment structure may be configured to alter a curvature of a largest planar surface of the wafer.
Claims20
A packaging system comprising:
- a wafer;
- and
- a curvature adjustment structure coupled thereto;
- wherein the curvature adjustment structure is configured to alter a curvature of a largest planar surface of the wafer.
1 more element
A packaging system comprising:
- a wafer;
- and
- an organic material bonded to a largest planar surface of the wafer;
- wherein the organic material is configured to alter a curvature of the largest planar surface of the wafer.
1 more element
A packaging system comprising:
- a wafer;
- and
- an organic material bonded to a largest planar surface of the wafer;
- wherein the organic material is configured to deflect at least a portion of the largest planar surface of the wafer.
1 more element
Dependencies are inferred from the claim text.