Package structure and method for forming same

Abstract

A package structure and a method for forming the same are provided. The package structure includes: a substrate, in which the substrate has a first surface and a second surface being opposite to the first surface, and has an opening penetrating through the first surface to the second surface of the substrate, the opening is in a long strip shape with a size at both two ends larger than a size at middle; a chip, in which the chip is fixed on the first surface of the substrate through solder bumps in a flipped over mode, and electrically connects with the substrate through the solder bumps, and the opening is located in a projection of the chip on the substrate; and a moulding compound wrapping the chip and filling the opening and a gap between the chip and the first surface of the substrate.

Dependencies are inferred from the claim text.