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US 2021/0343546 A1Published application
Electronic package and method for fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYung-Ta Li, Yi-Chian Liao, Kong-Toon Ng, Chang-Fu Lin
Life of this patent
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Abstract
An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.
Claims18
An electronic package, comprising:
- a packaging module defined with a chip placement portion and a peripheral portion surrounding the chip placement portion, wherein at least one electronic component is arranged on the chip placement portion, and a width of the peripheral portion is from an edge of the electronic component to an edge of the packaging module;
- and
- a packaging layer formed on the peripheral portion of the packaging module with a recess formed at a boundary corner of the packaging layer,
- wherein the recess has a step-like shape, and
- wherein the recess has a width of between 80% and 95% of the width of the peripheral portion.
2 more elements
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A method for fabricating an electronic package, comprising:
- providing a plurality of packaging modules arranged in a matrix, wherein each of the packaging modules is defined with a chip placement portion and a peripheral portion surrounding the chip placement portion at least one electronic component is arranged on the chip placement portion, each of the packaging modules adjoins one another via respective peripheral portion, and a width of the peripheral portion is from an edge of the electronic component to an edge of the packaging module;
- forming a packaging layer on the peripheral portion;
- forming at least one recess on the packaging layer at a boundary corner corresponding to the peripheral portion;
- and
- performing a singulation process along the peripheral portions of the packaging modules arranged in the matrix to obtain the electronic package having the recess formed at a boundary corner of the packaging layer after the singulation process,
- wherein the recess has a width of between 80% and 95% of the width of the peripheral portion.
3 more elements
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Dependencies are inferred from the claim text.