Controlling of height of high-density interconnection structure on substrate

An interconnection substrate for interconnecting chips, the interconnection substrate comprising:

• a base substrate;
• a first group of electrodes on the base substrate for a first chip to be mounted;
• a second group of electrodes on the base substrate for a second chip to be mounted;
• and
• an interconnection layer located within a defined area on the base substrate between the first group and the second group of the electrodes,
• wherein the interconnection layer carrying structure comprises a layer corresponding to the interconnection layer, a release layer on the layer and a support substrate on the release layer, the layer includes a set of pads for the first chip and the second chip and an organic insulating material, the set of the pads is embedded in organic insulating material, and the support substrate has a base part where the interconnection layer is formed and an extended part extending outside the base part.

An interconnection substrate for interconnecting chips, the interconnection substrate comprising:

• a base substrate;
• a solder resist layer on a portion of the base substrate;
• a defined area within the solder resist layer;
• an adhesive on the base substrate within the defined area;
• an interconnection layer on the adhesive;
• a plurality of pads in the interconnection layer;
• and
• a plurality of electrodes in the solder resist layer.