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US 2021/0343540 A1Published application
Laser contact ablation for semiconductor packages and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsFrancis J. CARNEY, Michael J. SEDDON
Life of this patent
Estimating the term…
Abstract
Implementations of a semiconductor substrate may include a plurality of die including at least one contact; and a plurality of portions of an encapsulant on a surface of the semiconductor substrate, wherein each portion of the plurality of portions extends immediately above a plane of the at least one contact.
Claims19
A semiconductor substrate comprising:
- a plurality of die comprising at least one exposed contact directly coupled to a first side of each of the plurality of die, the first side opposing a second side of the plurality of die directly coupled with a backmetal layer;
- and
- a plurality of portions of an encapsulant on a surface of the semiconductor substrate, wherein each portion of the plurality of portions extends immediately above a plane of the at least one exposed contact.
(canceled)
A method of forming a semiconductor package comprising:
- forming a plurality of electrical connectors on a first side of a wafer, the first side opposing a second side of the wafer configured to directly couple with a backmetal layer;
- applying a mold compound to the first side of the wafer, wherein the mold compound encapsulates the plurality of electrical connectors;
- and
- exposing the plurality of electrical connectors through the mold compound by ablating the mold compound immediately above each electrical connector of the plurality of electrical connectors with a laser.
1 more element
A semiconductor package comprising:
- at least one electrical contact comprising a perimeter, the at least one electrical contact directly coupled to a first side of a die opposing a second side of the die directly coupled with a backmetal layer;
- and
- a mold compound raised above a largest planar area of the contact immediately around the perimeter of the at least one electrical contact;
- wherein the perimeter of the at least one electrical contact is exposed through the mold compound.
1 more element
Dependencies are inferred from the claim text.