CMP System and Method of Use

A method comprising:

• performing a planarization process on a substrate;
• performing a first cleaning process on the substrate in a main tank of a tank cleaning device;
• performing a second cleaning process on the substrate using a buff pad of a chemical mechanical cleaning (CMC) device;
• performing a third cleaning process on the substrate using a brush of a brush cleaning device;
• performing a drying process on the substrate using a vapor dryer;
• and
• removing a plurality of ions from a cleaning solution used in one of the planarization process, the first cleaning process, the second cleaning process, the third cleaning process, or the drying process using a capacitive deionization device (CDD).