Method and device for bonding of substrates

A device for the bonding of a first substrate with a second substrate, said device comprising:

• a first holding device having a first holding surface for holding and fixing the first substrate;
• a second holding device having a second holding surface for holding and fixing the second substrate;
• wherein the first and second holding devices are configured for mutual approaching of the first and second substrates toward each other, for contacting of the first and second substrates at a bond initiation point and for generating a bonding wave advancing from the bond initiation point to side edges of the first and second substrates;
• and
• influencing means for influencing the bonding wave during the advancing of the bonding wave, wherein the influencing means include mechanical actuators for deforming the first holding surface of the first holding device, and thereby deforming the first substrate fixed on the first holding surface.

A method for bonding a first substrate with a second substrate, said method comprising:

• a) fixing of the first and second substrates to respective first and second holding devices, the first substrate fixed to a first holding surface of the first holding device and the second substrate fixed to a second holding surface of the second holding device;
• b) arranging of the first and second substrates relative to each other;
• c) mutual approaching of the first and second substrates toward each other;
• d) contacting the first substrate with the second substrate at a bond initiation point;
• e) generating a bonding wave advancing from the bond initiation point to side edges of the first and second substrates;
• f) influencing the bonding wave during advancing of the bonding wave by controlling spacing between the first and second substrates.

A device for the bonding of a first substrate with a second substrate, said device comprising:

• a first holding device having a first holding surface for holding and fixing the first substrate;
• a second holding device having a second holding surface for holding and fixing the second substrate;
• wherein the first and second holding devices are configured for mutual approaching of the first and second substrates toward each other, for contacting of the first and second substrates at a bond initiation point and for generating a bonding wave advancing from the bond initiation point to side edges of the first and second substrates;
• and
• influencing means for influencing the bonding wave during the advancing of the bonding wave, wherein the influencing means include spacing-changing means for changing spacing between the first and second substrates.

A method for bonding a first substrate with a second substrate, said method comprising:

• a) fixing of the first and second substrates to respective first and second holding devices, the first substrate fixed to a first holding surface of the first holding device and the second substrate fixed to a second holding surface of the second holding device;
• b) arranging of the first and second substrates relative to each other;
• c) mutual approaching of the first and second substrates toward each other;
• d) contacting the first substrate with the second substrate at a bond initiation point;
• e) generating a bonding wave advancing from the bond initiation point to side edges of the first and second substrates;
• f) influencing the bonding wave during advancing of the bonding wave by controlling ambient pressure of an atmosphere surrounding the first and second substrates, wherein increasing of said ambient pressure decelerates the advancing of the bonding wave and decreasing of said ambient pressure accelerates the advancing of the bonding wave.

A device for the bonding of a first substrate with a second substrate, said device comprising:

• a first holding device having a first holding surface for holding and fixing the first substrate;
• a second holding device having a second holding surface for holding and fixing the second substrate;
• wherein the first and second holding devices are configured for mutual approaching of the first and second substrates toward each other, for contacting of the first and second substrates at a bond initiation point and for generating a bonding wave advancing from the bond initiation point to side edges of the first and second substrates;
• and
• influencing means for influencing the bonding wave during the advancing of the bonding wave, wherein the influencing means include a pressure-changing means for controlling ambient pressure of an atmosphere surrounding the first and second substrates, wherein increasing of said ambient pressure decelerates the advancing of the bonding wave and decreasing of said ambient pressure accelerates the advancing of the bonding wave.