Cooled substrate support assembly for radio frequency environments

A substrate support assembly comprising:

• a base assembly for supporting an electrostatic chuck;
• a facility plate coupled to the base assembly;
• a dielectric plate coupled to the facility plate;
• a ground plate coupled to the facility plate;
• a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate;
• and
• a connector coupled to the ground plate that houses a portion of the fluid conduit, the connector comprising a biasing assembly and a fastener disposed in a pocket formed in the ground plate, and a sliding seal surrounding a body of the connector.

A substrate support assembly comprising:

• an electrostatic chuck;
• a base assembly coupled to the electrostatic chuck;
• a facility plate coupled to the base assembly;
• a dielectric plate coupled to the facility plate;
• a ground plate coupled to the facility plate;
• a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate;
• and
• a connector coupled to the ground plate that houses a portion of the fluid conduit, the connector comprising a biasing assembly and a fastener disposed in a pocket formed in the ground plate, and a sliding seal surrounding a body of the connector.