Plasma processing apparatus and plasma processing method

A plasma processing apparatus comprising:

• a processing container;
• a stage provided within the processing container;
• an upper electrode provided above a front surface of the stage, with a space within the processing container interposed therebetween;
• a waveguide configured to introduce radio frequency waves in a VHF band or a UHF band into the space;
• and
• a conductive part extending between an outer peripheral portion of the stage and a side wall of the processing container,
• wherein the stage includes a metal layer,
• the outer peripheral portion of the stage includes a part of the metal layer,
• the waveguide includes an end portion from which the radio frequency waves are emitted,
• the end portion is disposed so as to face the space,
• the side wall is grounded, and
• the conductive part is electrically connected to the metal layer and the side wall of the processing container, and extends from the outer peripheral portion toward the side wall so that the radio frequency waves emitted from the end portion are introduced into the space.

A plasma processing method for performing plasma processing on a workpiece using a plasma processing apparatus, wherein an upper electrode, a waveguide, and a stage are provided in a processing container of the plasma processing apparatus, the plasma processing method comprising:

• performing plasma processing in a state in which an outer peripheral portion of the stage and a side wall of the processing container are electrically connected to each other such that radio frequency waves in a VHF band or a UHF band are introduced from an end portion of the waveguide, which is provided so as to face a space between the upper electrode and the stage, into the space,
• wherein the side wall is grounded,
• the stage includes a metal layer,
• the outer peripheral portion includes a part of the metal layer,
• the plasma processing apparatus includes a conductive part, and
• the conductive part extends between the outer peripheral portion and the side wall so as to be electrically connected to the metal layer and the side wall.