Semiconductor wafer measurement method and system

A method of analyzing a semiconductor wafer, the method comprising:

• obtaining a graphic data system (GDS) file corresponding to the semiconductor wafer;
• obtaining user input related to coordinates of a layout feature of the semiconductor wafer;
• based on the user input, providing GDS information from the GDS file to an electron microscope, the GDS information comprising the coordinates of the layout feature;
• using the electron microscope to capture a raw image from the semiconductor wafer based on the coordinates of the layout feature;
• and
• performing a measurement operation on the raw image.

A semiconductor wafer analysis system, the system comprising:

• processing circuitry configured to:
• obtain a graphic data system (GDS) file corresponding to a semiconductor wafer;
• and
• use GDS information from the GDS file to output coordinates of a layout feature of the semiconductor wafer;
• an electron microscope configured to capture a raw image from the semiconductor wafer based on the coordinates of the layout feature received from the processing circuitry;
• and
• determining circuitry configured to perform a measurement operation on the raw image.