Production of Three-Dimensional Structures by Means of Photoresists

A process of producing three-dimensional structures comprising:

• providing a substrate with metal cladding for improving surface adhesion or for adapting the substrate for subsequent metal deposition and separation of structures from the metal-clad substrate;
• coating the metal-clad substrate at least once with a first photoresist for generating a defined height of at least one structure step, and coating the first photoresist at least once with a second photoresist for generating a defined height of at least one further structure step, the first photoresist and the second photoresist having different photosensitivities and transmission characteristics for patterning;
• exposing the first photoresist with a first exposure radiation having a first wavelength range and a first radiation dose in at least a first structure-forming region of the first photoresist;
• exposing at least the second photoresist with a second exposure radiation with a second wavelength range and a second radiation dose in at least a second structure-forming region of the second photoresist, wherein the first structure-forming region of the first photoresist and the second structure-forming region of the second photoresist at least partially overlap one another;
• developing at least one multi-layer photoresist structure from the overlapping structure-forming regions at least of the first photoresist and second photoresist by developing the non-structure-forming exposed regions of coatings of the at least the first photoresist and second photoresist.