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US 2021/0341633 A1Published application
Ct detector module and heat dissipation structure
AssigneeShanghai United Imaging Healthcare Co., Ltd.
InventorTing YE
Life of this patent
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Abstract
A detector module is provided. The detector module may include a plurality of detector sub-modules. Each of the plurality of detector sub-modules may include a detection layer, at least one data acquisition circuitry, a frame for supporting the detection layer, and a positioning element for assembling the plurality of detector sub-modules. The frame may include a plurality of heat transfer fins that are thermally connected with the at least one data acquisition circuitry for dissipating heat produced by the at least one data acquisition circuitry.
Claims20
A detector module comprising:
- a plurality of detector sub-modules including a first detector sub-module and a second detector sub-module adjacent to the first detector sub-module, the plurality of detector sub-modules being detachably assembled, wherein each of the plurality of detector sub-modules comprises:
- a detection layer configured to detect radiation;
- at least one data acquisition circuitry electrically connected with the detection layer, the at least one data acquisition circuitry being configured to process an electrical signal in response to the radiation detected by the detection layer;
- a frame for supporting the detection layer and the at least one data acquisition circuitry;
- and
- wherein the frame includes a base part that is Physically attached to the detection layer, and a columnar part that is perpendicular to or substantially perpendicular to the base part.
3 more elements
A detector module, comprising:
- a frame;
- a detection layer supported by the frame and configured to detect radiation;
- at least one data acquisition circuitry electrically connected with the detection layer, the at least one data acquisition circuitry being configured to process an electrical signal in response to the radiation detected by the detection layer;
- and
- a heat dissipation structure coupled to the frame, wherein the heat dissipation structure comprises a plurality of fins thermally coupled with the at least one data acquisition circuitry and the frame includes a base part that is physically attached to the detection layer, and a columnar part that is perpendicular to or substantially perpendicular to the base part.
2 more elements
Dependencies are inferred from the claim text.